SOLDER LEAD FREE GR 250 0.8 MM
content: 3.8 % silver, 0.7 % copper, 93.8 % tin; content of flux core: 2 %; melting point 217° C
content: 3.8 % silver, 0.7 % copper, 93.8 % tin; content of flux core: 2 %; melting point 217° C
content: 3.8 % silver, 0.7 % copper, 93.8 % tin; content of flux core: 2 %; melting point 217° C first class major brand solder wire made in China highly improved electrical conductivity by means of a composition with a content of 3.8 % silver no cleaning of the capillary joints after soldering necessary "No-Clean-Solution" with continuous flux core halogenfree and low formation of smoke
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